Founded more than 14 years ago, ADI Electronics Incorporation is located in Dallas, Texas, USA. It specializes in manufacturing D-Subminiature connectors for the Aerospace and Defense Industry. Its products caters to aerospace, avionics, defense and industrial customers, including D-sub connector solutions with a full range of customized design, manufacturing, and testing services.

Products MIL-DTL-24308

The ADI D-Sub connector is available in a variety of basic shell sizes and pin-outs. Standard shell sizes are 9, 15, 25, 37 and 50 positions. Contacts are available in 20 AWG solder-pot, crimp or printed circuit contacts and intermate with MIL-DTL-24308 connectors.   Features

• Standard contact termination accommodates 20 AWG wire at 5 Amps.
• Shells: Steel, cadmium plated with yellow chromate supplementary coating.
• Insulators: Commercial/Military – Green polyester per MIL-M-24519
• Contacts: Non-Removable and Removable
• Pins – copper alloy, gold over nickel plate.
• Sockets – phosphor bronze, gold over nickel plate.
• Float mounting available
• Rivets and Washers: Stainless Steel

  Mechanical Features

• Coupling: Friction and Locking Accessories
• Polarization: Keystone shaped shells
• Contact type: Captivated
• Termination: Solder pot, crimp removable and printed circuit (including right-angle)

Electrical Performance Data

• Wire Size: 20 AWG 
• Current Rating: 5 amps 
• Voltage Rating: 1250 VAC at sea level – 375 VAC at 70,000 feet 
• Voltage Drop: 20 AWG contacts: 55mV Max initial and 65 mV Max after corrosion at 7.5amps

Services offered by ADI are described below:   ADI Services specialize in custom connector designs. ADI’s in-house tool and die facility is equipped with state of the art EDM equipment, surface grinders and milling machines that allow for rapid prototyping and hard tooling to meet tight schedule, while controlling costs. The in-house lab facilities are equipped to provide qualification, acceptance and testing services.   Lab Facilities/Equipment

• Altitude Immersion
• Dielectric withstanding
• Resistance to Soldering
• Probe Damage
• Voltage
• Heat
• Immersion
• Cable Retention
• Contact Pin Strength
• Barometric Pressure
• Insulation Resistance
• Solderability
• Moisture Resistance
• Contact Engagement
• Insert Retention
• Thermal Shock
• Separation Force
• Fluid Immersion
• Life
• Temperature Cycling
• Contact Retention
• High Frequency Vibration
• Humidity, Vibration
• Mating & Unmating Force
• Vibration
• Shock, Durability
• Force
• Terminal Strength Salt Spray
• Contact Insertion
• Random Vibration
• Oversized Pin Exclusion
• Removal Force
• Resistance to Solvents
• Maintenance Aging Resistance to Test
• Visual & Mechanical
• Contact Resistance
• Probe Damage